Excellent heat dissipation performance: It features a large back pad area. Compared with SOD-123FL, the heat dissipation path is optimized, shifting from pin-based heat dissipation to back metal pad heat dissipation. The metal heat dissipation area is increased by 89%.

Miniature package size: Its length and width are both reduced by 56% compared with the SOD-123HE package, perfectly meeting the development trend of package miniaturization.

Ultra-thin package design, suitable for miniaturized and slim circuit applications.

Equipped with a heat sink on the package bottom surface for excellent heat dissipation performance.

Manufactured with eco-friendly materials and fully compliant with RoHS standards.

Widely used in secondary rectification circuits, converters, freewheeling diodes, as well as AC/DC power supply protection scenarios.