Yangjie Technology has recently released an ESD device in DFN1006-2L package. With a compact size and ultra-thin profile, it meets the application requirements of high-speed communication interfaces.

The device features small package footprint, low parasitic capacitance, high surge protection capability and low clamping voltage. Adopting SCR deep snap-back structure technology, it is applicable to application circuits that demand ultra-low clamping voltage, providing safer and more reliable protection performance.

• Ultra-thin package outline, suitable for miniaturized and thinned circuits;

• Ultra-low junction capacitance, 0.2 pF (Typ);

• SCR deep snap-back structure;

• Low surge clamping voltage and high IPP characteristics.