Yangjie Technology has recently launched a new generation 650V IGBT module in the easy 1B package. The IGBT chips employed are built on a next-generation micro-trench process platform, featuring low losses, a high operating junction temperature, and strong short-circuit capability. The module also utilizes DBC (Direct Bonded Copper) insulation copper substrate technology, which offers excellent insulation performance, high thermal conductivity, and robust mechanical structure, resulting in outstanding heat dissipation. With good parameter consistency and high reliability, this module is suitable for various medium-to-low frequency applications such as servos and frequency converters.

1. Low switching losses

2. Low VCE(sat) IGBT with positive temperature coefficient

3. Includes fast and soft recovery freewheeling diodes

4. Low-inductance package

5. Strong short-circuit capability (5 µs)

6. DBC substrate thermal dissipation technology for excellent heat dissipation performance

7. Maximum junction temperature up to 175°C